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 DATA SHEET
HYBRID INTEGRATED CIRCUIT
MC-9400A
320 (240)-BIT AC- PDP DRIVER MODULE
DESCRIPTION
The MC-9400A is a PDP driver module that incorporates five 64-bit high breakdown voltage output (150 V, 40 mA) CMOS driver ICs. It supports 320 outputs in the case of 4-bit parallel input, and 240 outputs in the case of 3-bit parallel input. The integrated structure of the MC-9400A, which combines a COB with an aluminum heat sink and an output flexible printed circuit (FPC) board, enables the easy implementation of heat dissipation measures and high-density mounting.
FEATURES
* Incorporates five PD16337s with four 16-bit bi-directional shift registers * Low thermal resistance realized by chip-on-metal structure * Provided with connector and capacitor for easy mounting on a panel * Supports output electrode with a narrow pitch through use of a flexible printed circuit board * Polarity of all driver outputs can be inverted through use of /PC pins * Supports custom modules
Remark /XXX indicates active low.
ORDERING INFORMATION
Part Number MC-9400A Package COB
The information in this document is subject to change without notice.
Document No. Printed in Japan S13787EJ2V0DS00 (2nd edition) Data Published October 1998 NS CP(K)
The mark 5 shows major revised points.
(c) NEC Corporation 1998
MC-9400A
BLOCK DIAGRAM (1/5 CIRCUIT)
CN3
74AC244
PD16337
/PC BLK LE R,/L A1 A2 A3 A4 O1 O2 O3 O4 O5 O6 O7
CN1,2
VDD1 (Logic power supply) VDD2 (Driver power supply)
B1 B2 B3 B4 /CLK
O60 O61 O62 O63 O64
Remark Five PD16337s incorporated : 240 outputs at 3 ch and 320 outputs at 4 ch. See the following block diagram for the PD16337.
PD16337 BLOCK DIAGRAM
/PC BLK LE
SR1 A1 /CLK R,/L B1 A1 CLK R,/L B1 S61 S1 S5 S1 S2 S3 S4
LE /L1
Note
O1
SR2 A2 A2 CLK R,/L B2 B2 S62 S2 S6
SR3 A3 A3 CLK R,/L B3 B3 S63 S3 S7
SR4 A4 A4 CLK R,/L B4 B4 S64 S61 S62 S63 S64 /L64 S4 S8
S64
SRn : 16-bit shift register
Note High breakdown voltage CMOS driver 150V, 40 mA(MAX.). 2
MC-9400A
5
PIN CONFIGURATION (Top View)
EPC CN3
B54 B53 B52 B51 A51 A52 A53 A54 B44 B43 B42 B41 A41 A42 A43 A44 GND /CLK GND LE GND R,/L GND /PC GND BLK B34 B33 B32 B31 A31 A32 A33 A34 B24 B23 B22 B21 A21 A22 A23 A24 B14 B13 B12 B11 A11 A12 A13 A14 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
O320
CN2 VDD2 GND VDD1 1 2 3
O257 O256
O194 O193
O129 O128
O65 O64 CN1 VDD2 GND VDD1 1 2 3 O1
Caution To prevent latch-up breakage, be sure to turn the power on in the order of VDD1, logic signal, and VDD2, and turn the power off in the reverse order. Keep this order also during a transition period.
3
MC-9400A
PIN FUNCTIONS
Pin Symbol /PC Pin Name Polarity inverted input BLK LE Blanking input Latch enable input 25 31 CN3 CN3 BLK = H : All outputs = H or L Automatically latches by a high level input at the rising edge of the clock A11 to A14, A21 to A24, A31 to A34, A41 to A44, A51 to A54 B11 to B14, B21 to B24, B31 to B34, B41 to B44, B51 to B54 /CLK R,/L Clock input Shift control input LEFT data input RIGHT data input 1 to 4 9 to 12 17 to 20 35 to 38 46 5 to 8 13 to 16 21 to 24 39 to 42 47 to 50 33 29 CN3 CN3 Executes a shift at the rising edge Right shift mode by H SR1 : A1 S1 ... S61 B1 (SR2, SR3, and SR4 also same direction) Left shift mode by L SR1 : B1 S61 ... S1 A1 (SR2, SR3, and SR4 also same direction) CN3 CN3 When R,/L = H A11 to A14, A21 to A24, A31 to A34, A41 to A44, A51 to A54 : Input B11 to B14, B21 to B24, B31 to B34, B41 to B44, B51 to B54 : Output When R,/L = L A11 to A14, A21 to A24, A31 to A34, A41 to A44, A51 to A54 : Output B11 to B14, B21 to B24, B31 to B34, B41 to B44, B51 to B54 : Input Pin No. 27 I/O CN3 Description /PC = L : Polarity of all outputs inverted
O1 to O320
High breakdown voltage output
1 to 320
FPC
150 V, 40mA
(MAX.)
VDD1
Logic block power supply
1
CN1 CN2
5 V 10 %
VDD2
Driver block power supply
3
CN1 CN2
30 V to 130 V
GND
Ground
2
CN1 CN2
Connected to system ground
26,28, 30,32, 34
CN3
4
MC-9400A
TRUTH TABLE
1. Shift register block
Input R,/L H H L L /CLK Input X X Output Output
Note2
Output Shift register A B Output
Note1
Execution of right shift Retain Execution of left shift
Output Input
Retain
Notes 1. On a clock rise, the data S57, S58, S59, and S60 are shifted to S61, S62, S63, and S64, and output from B1, B2, B3, and B4, respectively. 2. On a clock fall, the data S5, S6, S7, and S8 are shifted to S1, S2, S3, and S4, and output from A1, A2, A3, and A4, respectively.
Remark X= H or L, H= High level, L= Low level
2. Latch block
LE H L /CLK X Output state of latch block (/Ln) Latches the data of Sn and retains the output data Retains the latch data Retains the latch data
Remark X= H or L, H= High level, L= Low level
3. Driver block
/Ln X X X X BLK H H L L /PC H L H L Driver output state H (all driver outputs : H) L (all driver outputs : L) Outputs latch data (/Ln) Outputs latch data (/Ln) with polarity inverted
Remark X= H or L, H= High level, L= Low level
5
MC-9400A
ELECTRICAL CHARACTERISTICS
Absolute maximum ratings (TA = +25C, VSS1 = VSS2 = 0 V)
Parameter Logic block supply voltage Driver block supply voltage Logic block input voltage Driver block output current Module allowable power dissipation Junction temperature Operating ambient temperature Storage temperature Symbol VDD1 VDD2 V1 IO2 PdMAX. TjMAX. TA Tstg Ratings - 0.5 to + 7.0 - 0.5 to + 150 - 0.5 to VDD1 + 0.5 40 6
Note
Unit V V V mA W C C C
125 - 10 to + 70 - 40 to + 85
Note The value when mounting this driver module on the aluminum frame by screw.
Caution If the absolute maximum rating of even one of the above parameters is exceeded even momentarily, the quality of the product may be degraded. Absolute maximum ratings, therefore,specify the values exceeding which the product may be physically damaged. Be sure to use the product within the range of the absolute maximum ratings.
Recommended operating range (TA = -10 to + 70C, VSS1 = VSS2 = 0 V)
Parameter Logic block supply voltage Driver block supply voltage Input voltage high Input voltage low Driver output current Symbol VDD1 VDD2 VIH VIL IOH2 IOL2 MIN. 4.5 30 0.7 VDD1 0 -30 +30 TYP. 5.0 MAX. 5.5 130 VDD1 0.2 VDD1 Unit V V V V mA mA
6
MC-9400A
Electrical specifications (TA = +25C, VSS1 = VSS2 = 0 V)
Parameter Output voltage high Output voltage high Output voltage low Output voltage low Input leakage current (H1) PU Input leakage current (H2) PC Input leakage current (L2) PC Input voltage high Input voltage low Power supply current 1(Logic) Power supply current 1(Logic) Power supply current 2 (Driver) Power supply current 2 (Driver) Power supply current 2 (Driver) Power supply current 2 (Driver) IDD2 Out :LHLHHLHL 500 IDD2 Out :HLHLLHLH 500 IDD2 Symbol VOH21 VOH22 VOL21 VOL22 ILIH1 ILIH2 ILIL2 VIH VIL IDD1 a1 IDD1 -1 IDD2 VDD1 = 5.0 V VDD2 =135 V Out : ALL High 500 Conditions VDD2 = 130 V,IOH = -10 mA VDD2 = 130 V,IOH = -30 mA VDD2 = 130 V,IOH = 10 mA VDD2 = 130 V,IOH = 30 mA VDD1 = 7.0 V,VDD2 = 30 V VDD1 = 7.0 V,VDD2 = 30 V VDD1 = 7.0 V,VDD2 = 30 V VDD1 = 5.0 V,VDD2 = 30 V VDD1 = 5.0 V,VDD2 = 30 V VDD1 = 7.0 V In : High Level Out : ALL Low -4.0 -4.0 -4.0 3.5 1.0 8 80 500 MIN. 123 110 5.0 15.0 +4.0 +4.0 +4.0 TYP. MAX. Unit V V V V
A A A
V V mA
A A
A
A
A
Switching characteristics (TA = +25C, VSS1 = VSS2 = 0 V)
Parameter Propagation delay time Propagation delay time Propagation delay time Symbol tPLH2 tPHL2 tPLH3 Conditions VDD1 = 5.0 V, VDD2 = 130 V VDD1 = 5.0 V, VDD2 = 130 V VDD1 = 5.0 V, VDD2 = 130 V, BLKOUT Propagation delay time tPHL3 VDD1 = 5.0 V, VDD2 = 130 V, BLKOUT Propagation delay time tPLH4 VDD1 = 5.0 V, VDD2 = 130 V, PCOUT Propagation delay time tPHL4 VDD1 = 5.0 V, VDD2 = 130 V, PCOUT Rise time Fall time Maximum clock frequency tTLH tTHL fMAX. VDD1 = 5.0 V, VDD2 = 130 V VDD1 = 5.0 V, VDD2 = 130 V VDD1 = 4.0 V, VDD2 = 30 V 25.0 200.0 200.0 ns ns MHZ 160.0 ns 160.0 ns 172.5 ns MIN. TYP. MAX. 187.5 187.5 172.5 Unit ns ns ns
7
MC-9400A
Timing requirements (TA = +25C, VSS1 = VSS2 = 0 V)
Parameter Data setup time 1 Data setup time 2 Data hold time Latch enable time 1 Latch enable time 2 Latch enable time 3 Latch enable time 4 Symbol tSETUP1 tSETUP2 tHOLD tLE1 tLE2 tLE3 tLE4 Conditions VDD1 = 4.5 V, VDD2 = 30 V VDD1 = 4.5 V, VDD2 = 30 V VDD1 = 4.5 V, VDD2 = 30 V VDD1 = 4.5 V, VDD2 = 30 V VDD1 = 4.5 V, VDD2 = 30 V VDD1 = 4.5 V, VDD2 = 30 V VDD1 = 4.5 V, VDD2 = 30 V MIN. 31.2 12.0 8.5 27.5 17.5 27.5 17.5 TYP. MAX. Unit ns ns ns ns ns ns ns
8
MC-9400A
Timing chart (Right shift)
/CLK A1 (B4) A2 (B3) A3 (B2) A4 (B1)
S1 (S64) S2 (S63) S3 (S62) S4 (S61) S5 (S60) S6 (S59) S7 (S58) S8 (S57)
LE BLK /PC
O1 (O64) O2 (O63) O3 (O62) O4 (O61) O5 (O60) O6 (O59) O7 (O58) O8 (O57)
Remark () applies when R,/L = L 9
MC-9400A
Switching characteristics waveform
Propagation delay time tPHL2, tPLH2
/CLK2
50 %
50%
tPHL2 90 % On
tPLH2 On 10%
Propagation delay time (BLK OUT) tPHL3, tPLH3
BLK
50 %
50%
tPHL3 90 % On
tPLH3
10%
10
MC-9400A
Propagation delay time (/PC OUT) tPHL4, tPLH4
/PC
50%
50%
tPHL4 90% On
tPLH4
10%
Rise time, Fall time tTLH, tTHL
tTLH tTHL
On
90 % 10%
90 % 10%
Maximum clock frequency FMAX.
1/fMAX.
CLK2
50%
50%
11
MC-9400A
Data setup time1, 2, and Data hold time tSETUP1, tSETUP2, tHOLD
/CLK1
50%
tSETUP2
tHOLD
DATA
50%
tSETUP1
/CLK2
50%
Latch enable time1, 2, 3, 4 tLE1, tLE2, tLE3, tLE4
/CLK2
50%
50%
50%
tLE1
tLE2
tLE3
tLE4
LE
50%
50%
12
MC-9400A
PACKAGE DRAWING (unit : mm)
COB with radiation board attached + FPC module
101.4
10
2-10 1.25
5
MC-9400A C2 10.95 35.05 92.0 35.05 10.95
15 33.0 63
1.5
C2
7 MAX.
13
MC-9400A
[MEMO]
14
MC-9400A
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
15
MC-9400A
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5


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